Description
epoxy resin twin
very flexible
low viscosity
Temperature range -50 to 155 ° C using
class F
APPLICATION:
For encapsulation, filling and sealing of electrical and electronic components.
The resin ULTIFIL 2001 – 815 is a double epoxy system very flexible component for encapsulating, filling and sealing of electrical and electronic components.
This resin is also available in self-extinguishing degree UL94 V0 version as for applications that require it.
The product shows a high adhesion on the housings maintained vacuum on inserts and other accessories, characterized by its ease of processing at room temperature, very low viscosity of the mixture. Once cured provides excellent resistance to thermal shock cracking, chemicals and moisture.
epoxy resin twin
very flexible
low viscosity
Temperature range -50 to 155 ° C using
class F
APPLICATION:
For encapsulation, filling and sealing of electrical and electronic components.