The resin ULTIFIL 2001 – 2114 TCB is a dual component epoxy system loads for encapsulation and sealing of electrical and electronic components.
Possibility of supply in various colors depending on the amounts, being the standard black color.
The system has been specially designed to provide a very high thermal conductivity and excellent electrical properties at elevated temperatures, maintaining a low viscosity of the mixture to facilitate its application.
The resin, once polymerized, has excellent electrical properties together with a high resistance to thermal shock, allowing its use with security systems isolation to H (180) class.
epoxy resin twin
Class H (180 ° C)
High thermal conductivity
Various colors available
Excellent resistance to thermal shock
For encapsulation, filling and sealing of electrical and electronic components.
Particularly suitable for the encapsulation and filling heads of coils for rotating machines to improve heat dissipation
